The research project will be performed in the Soft Matter Rheology and Technology (SMaRT) section in the Chemical Engineering Department at KU Leuven and the Processing and Performance of Materials (P&P) section in the Mechanical Engineering Department at TU Eindhoven under the joint supervision of Profs. Lambèrt van Breemen and Ruth Cardinaels. The research in the SMaRT section is mostly of experimental nature and aims at designing methodologies for intelligent process or product (formulation) design using so-called “complex fluids” or “soft matter”. Extensive state-of-the-art and home-built experimental facilities for the characterization of rheological properties, combined with various techniques to characterize microstructure development during flow are available. Dielectric and electromagnetic properties can be characterized in the low frequency as well as high frequency region. The research in the P&P section aims to enable a transition from experimental trial-and-error to quantitative predictive capability for the processing of polymer-based materials. Experimental characterization facilities range from rheology, over structure and thermal characterization to mechanics. Moreover, cutting-edge in-house developed numerical tools are integrated in the research. Industrial-level insights on semiconductor manufacturing and material development will be available via collaboration with IMEC, a world-leading R&D and innovation hub in nanoelectronics and digital technologies, based in Leuven.
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Project
Polymer-based integrated circuit (IC) packaging and polymer redistribution layers (PRLs) are indispensable for the long-term functioning of microchips sustaining variable thermal and mechanical stresses, while ensuring electrical connectivity to the circuit board and shielding unwanted interfering signals. Due to the increasing design complexity and miniaturization of microchips, dimensional accuracy and defect-free moulding and patterning have become critical requirements. However, differences in thermal expansion coefficients, processing-induced shrinkage and mechanical stresses can cause warpage, delamination and failure. To improve the polymer material formulation, as well as the processing steps and geometric microchip design with the aim of creating robust, defect-free IC packaging and PRLs, a simulation-integrated toolbox will be developed and used. Based on small-scale experimental characterizations of mechanical, dielectric and electromagnetic properties, analytical models for the prediction of the intrinsic material behaviour will be set up. Subsequently, these models will be implemented within a simulation framework, allowing to perform finite element-based predictions of the material response on the microchip level. Finally, this framework will then be leveraged for a case study on enhanced chip development, focusing on the one hand on optimal mechanical robustness and shape stability during thermal cycling and on the other hand on the integration of electromagnetic shielding functionality in an IC packaging.
Profile
- You are recently graduated or will soon graduate with a master degree in materials science engineering, mechanical engineering, or a related discipline.
- You have excellent analytical skills, high grades and you are a creative and critical thinker.
- You are highly motivated to start your career in research and to pursue a PhD degree during a four year research period.
- You have a strong experimental background in characterization and structure analysis of polymer-based materials and/or a strong background in numerical modeling and/or computational physics/mechanics, candidates with a combined expertise will have priority.
- You have enthusiasm and aptitude for combining experimentation and numerical modelling.
- You are able to report your progress in an accurate and timely fashion.
- You have excellent communication skills, with fluency in both written and spoken English.
- You are willing to integrate in both research groups and to spend half of the research time at each university.
- You are motivated to develop your teaching skills and coach students.
Offer
- Full-time PhD position for four years with a competitive salary and additional benefits such as health insurance, access to university sports facilities, holiday and year-end allowance etc.
- International working environment and possibility to present your work on international conferences.
- Your research will be embedded in two multidisciplinary research teams at both KU Leuven and TU Eindhoven, whereby half of the research time will be spent at each university.
- A state-of-the-art experimental infrastructure and cutting-edge numerical modelling capabilities.
- High-quality training programs and other support to grow into a self-aware, autonomous scientific researcher. To this end, you will participate in the Arenberg Doctoral School doctoral training program (Arenberg Doctoral School).
- An allowance for commuting, working from home and internet costs.
- A full-time employment for four years, with an intermediate evaluation after nine months.
- Upon successful completion of the doctoral program, you will be awarded PhD degrees from two internationally top-ranked universities.
Interested?
For more information please contact Prof. Dr. Ir. Lambèrt van Breemen ([email protected]) or Prof. Dr. Ir. Ruth Cardinaels ([email protected]).
Since this is a joint PhD within the KU Leuven - TU Eindhoven Global PhD Partnership Program, please also apply to the corresponding vacancy at TU Eindhoven to be considered.
We look forward to your application and will screen it as soon as we have received it. Screening will continue until the position has been filled.
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